1～8 item / All 8 items
Research and development etching device SPE40
【Process】Input → Etching → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Substrate Size】Max. W400×L500mm Thickness 0.4〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1300×L1590×H1215mm - Space-saving for research use - Ideal for material development and testing - Capable of etching PCBs and LCDs
Compact etching machine that is suitable for narrow spaces, allows for customizable settings based on usage, and achieves short delivery times.
【Process】Input → Etching → Liquid Drain → Rinse 1 → Rinse 2 → Squeeze → Extraction 【Board Size】Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1420 × L1950 × H1645 mm - Space-saving for research use - Ideal for material development and testing - Capable of etching PCB and LCD
Ninomiya System ITO Etching Equipment
We contribute to enhancing our customers' added value by utilizing advanced fine processing technology for development and etching, as well as sophisticated thin plate transportation technology.
It is possible to stably transport workpieces with a thickness of 50 μm, and it is also compatible with FPC transport.
The copper surface roughening treatment device, micro-etching device, is a surface treatment device capable of stably transporting workpieces with a thickness of 50 μm. The fine specification nozzle pattern and oscillation mechanism enable uniform surface accuracy. The upper etching is individually pressure-controlled for even higher precision. For more details, please contact us or refer to the catalog.
Small thin plate etching device FBE40
【Process】Input → Air Knife → Etching → Air Knife → Recirculating Water Wash → Direct Water Wash → Air Knife → Extraction 【Board Size】Min. W50×L50mm Thickness 0.03〜2.0mm 【Nozzle Swing】Horizontal Swing 【Device Size】W1445×L2010×H1230mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs
Compact Ultra-High Precision Etching Device MPE40
【Process】 Input → Etching → Liquid Drain → Acid Wash → Liquid Drain → Circulation Water Wash → Direct Water Wash → Squeeze → Extraction 【Board Size】 Max. W400 × L500 mm Thickness 0.4 to 2.0 mm 【Nozzle Swing】 Neck Swing 【Device Size】 W1530 × L2830 × H1860 mm - Ideal for material development and testing - Supports from research to small-scale production - Capable of etching PCBs and LCDs
Ninomiya System manufactured H-down device
Achieving excellent surface accuracy with an ideal nozzle arrangement.
High-precision processing type micro-etching device
Achieves uniform surface accuracy with no irregularities in processing, compatible with thin plate transport (t50μm).
